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QF25 :QUICKFILL NO-MIX GROUND ENHANCING BACKFILL

QF25 :QUICKFILL NO-MIX GROUND ENHANCING BACKFILL
nVent ERICO Quickfill is a no-mix ground-enhancing backfill that reduces resistance to ground and enables convenient installations. Quickfill is designed to minimize dust and eliminate mixing.

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 中文标题:艾力高非混合型接地增强材料

QF25 QUICKFILL NO-MIX GROUND ENHANCING BACKFILL

nVent ERICO Quickfill is a no-mix ground-enhancing backfill that reduces resistance to ground and enables convenient installations. Quickfill is designed to minimize dust and eliminate mixing. It is the ideal material to use in areas of poor conductivity such as rocky ground, mountain tops, and sandy soil. Once installed, Quickfill is maintenance-free, not requiring periodic charging. Dry ground enhancement materials are more sensitive to seasonal variability than cement-based materials.

FEATURES

Lowers system resistance to ground

Low-dust formulation

Water not needed to install or perform

Fast installation with no mixing or cure time required

Can be installed in below-freezing temperatures

Does not dissolve, decompose, or leach out with time

Corrosion-resistant

Sulfur content below 2% per IEC 62561-7

Easy-to-handle 25 lb (11.3 kg) bags

Requires only one person to install  KLPC  QF25

Resistance measurements can be taken immediately after installation

Complies to the U.S. Environmental Protection Agency (EPA) Toxicity Characteristic Leaching Procedure (TCLP), EPA test method 1311

Complies to EN 12457-2 Characterization of Waste Leaching Procedure, ENV 12506 and ENV 13370

SPECIFICATIONS AND DETAILS
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APPLICATION
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